Circuit forming process

电路形成制程

Abstract

The invention relates to a circuit forming process, which comprises the following steps of: arranging a plurality of glue dots on one surface of a carrier; adhering an electronic element onto each glue dot; forming protective layers on the surface on which the glue dots are arranged; forming a circuit path between the protective layers; forming a circuit layer in the circuit path; and removing the protective layers. By the process, the circuit layer is uniform or complete, and the electronic elements and the carrier which are combined can have low impedance so as to avoid power waste.
本发明涉及一种电路形成制程,其在一载体的一面设有多个胶点,各胶点粘设有电子元件,在该面形成有保护层,在保护层之间形成有电路通道,电路通道中形成有电路层,移除保护层,本发明系通过此一制程,以使电路层得以均匀或完整,并可使已结合的电子元件与载体具有较小的阻抗,以避免功率浪费。

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